Underfill

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The underfill adhesive is one compnent,low viscosity,low tenperature heat curing. It has excellent electrical properties, weather resistance, and chemical resistance.

Mainly be used in phone/touch screen/PDA/computer motherboard industry,has excellent structural bonding effect.
Technical Date Sheet


Product
Number

Color

Viscosity
(mPa.s)

Tg℃

Whether Can Repair

The curing conditions
Minutes / temperature

(Mpa)Shear Strength

packing

Product Application

JLD-5351

Black

375

69

yes

15/120
10/130

5

30ML
50ML

CSP,BGA universal,low viscosity,Good liquidity,flowing in room temperature,good permeability,easy to repair.

JLD-5352

Black

1800

53

yes

5/120
2/130

8

30ML
50ML

CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

JLD-5354

Brown

4300

110

no

15/120
30/130

10

30ML
50ML

CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

JLD-5354

Black

360

113

no

15/120
10/130

6

30ML
50ML

CSP,BGA universal,low viscosity,good liquidity,flowing in room temperature.It is used in mobile electronic component adhesive filling .

JLD-5355

Opal

4500

68

no

15/120
12/150
30/100

8

30ML
50ML
250ML

CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

 Notice: Underfill adhesive can be customized.

Update Time:2014-03-31 16:25:25Hit:4392Size:T|T
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