Camera Module

Camera Module

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The CCD / CMOSof Kim chemical is based epoxy as the main single component, fast heat curing adhesive.

It is applied to a memory card, CCD / CMOS and other devices, an excellent variety of lens mount adhesive properties of plastic materials particularly suitable for heat-sensitive components require low temperature curing; fully compliant with the EU RoHS environmental protection, halogen-free requirements.
Technical Date Sheet


Product Number

Curing Type

Color

Viscosity

(Mpa)Shear Strength

Working
Temperature

Distortion
Temperature

JLD-3128

Hypothermia curing epoxy

black

3200

25

120℃

160℃

JLD-3129

Hypothermia curing epoxy

white

3500

25

120℃

160℃

JLD-3329

UV Curing

clear

3800

23

85℃

150℃

JLD-3429

UV Curing

clear

500

25

85℃

150℃


Update Time:2014-03-31 16:24:39Hit:4573Size:T|T
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